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Wire Bond Equipment Staff Engineer

Ams Osram | bayan lepas, Malaysia | Posted June 05, 2026

Position Overview

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the‑art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Equipment Maintenance & Troubleshooting

  • Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.).
  • Diagnose and resolve equipment‑related issues to minimize downtime.
  • Lead root cause analysis (RCA) for recurring failures and implement corrective actions.

Process Optimization

  • Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput.
  • Conduct DOE (Design of Experiments) to enhance process stability and performance.
  • Work with process engineers to qualify new materials (wire types, capillaries) and bond pad desig...

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