Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.
Job Description:
Research and Development
Process Innovation: Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory.
Material Science: Investigating and selecting appropriate bonding materials (e.g., low-temperature organic/inorganic materials, Cu/oxide, Cu/polymer) to ensure strong and stable interfaces.
Parameter Optimization: Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (e.g., CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy.
Problem Solving: Addressing challenges related...