The Die Attach /Clip Attach (Solder) Engineer own, develop, and sustain the solder die attach & clip attach process to achieve stable yields, high equipment uptime, and full compliance to reliability and customer requirements. The role demands wide semiconductor manufacturing experience across high‑mix assembly, rigorous process controls, and data‑driven problem solving to support both NPI ramp and high‑volume manufacturing.


**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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