ESSENTIAL DUTIES AND RESPONSIBILITIES

• As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuit board assembly (PCBA) level, and host level.
• The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
• The focus will be on solutions to meet increased demands for small form‑factor packages with constrained physical and thermal environments.

QUALIFICATIONS

REQUIRED

• B.S. in Mechanical Engineering plus 5 years of relevant industry experience.
• Solid knowledge through academic coursework or experience required in mechanical design.
• Proficiency in CAD software (e.g. SolidWorks, AutoCAD).
• Knowledge of engineering drafting standards and tolerance analysis.
• A strong backgrou...