About the role

As Senior Principal Engineer – GaN Package Development (m/f/d), you will be a technical authority and innovation leader responsible for defining, developing, and industrializing advanced packaging technologies for GaN power devices and modules.

This role drives package architecture strategy, leads complex cross‑functional programs from concept to high‑volume manufacturing, and serves as a key technical interface across R&D, manufacturing, suppliers, and customers.

The position requires deep expertise in GaN backend technologies, strong system‑level understanding of power device requirements, and proven leadership in introducing new packaging platforms into production.

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