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Senior Thermo Compression Bonding (TCB) Engineer [ Advanced Semiconductor Packaging | HBM | CoW[...]

THE SUPREME HR ADVISORY PTE. LTD. | singapore, Singapore | Posted June 09, 2026

Position Overview

Senior TCB Application & Technical Sales Engineer
  • Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
  • Support technical sales activities and customer discussions.
  • Benchmark competitor equipment and identify technology gaps.
  • Translate customer requirements into internal equipment specifications.
  • Develop and optimize TCB process parameters on TCB Equipments.
  • Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
  • Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.
  • Conduct DOE and process characterization activities.
  • Work closely with Mechanical, Software, Electrical, Motion and Vision teams.
  • Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process w...

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