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A*STAR - Agency for Science, Technology and Research | singapore, Singapore | Posted May 30, 2026
Position Overview
Responsibilities - Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
- Understand and generate package design layouts, process-flow concepts, test vehicle plans, and validation strategies.
- Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.
- Develop advanced package-level and wafer-level optical interconnect solutions for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
- Perform optical simulation and analysis to assess coupling loss, alignment tolerance, package-stack effects, and interface-related optical performance.
- Design and evaluate optical coupling structures, including grating-coupler, edge-coupler, lens-assisted, and fiber-array-based interfaces.
- Develop passive fiber alignment concepts and detachable low-loss optical connector schemes for high-density optical I/O integration.