Job Description Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next‑generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross‑functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan‑out, semiconductor dicing, and reflow processes, while staying abreast of cutting‑edge technologies, we encourage you to apply!

How You Will Contribute And What You Will Learn

Lead next generation Silicon Photonics package design in collaboration with cross‑functional teams, stakeholders and vendors to ensure package requirements are met.

Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo‑compression bonding, und...