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STATS ChipPAC | singapore, Singapore | Posted June 25, 2026
Position Overview
Responsibilities - Lead and manage semiconductor backend manufacturing operations across Backgrind, Laser Mark, Laser groove, Wafer Saw, AOI, and Tape & Reel processes to achieve safety, quality, delivery, cost, and productivity targets.
- Drive operational excellence through continuous improvement initiatives focused on yield enhancement, cycle time reduction, equipment utilization, and cost optimization.
- Lead multiple production shifts through supervisors and engineers, ensuring effective manpower planning, workforce development, and operational discipline.
- Manage customer escalations, production risks, and quality excursions, ensuring timely containment, root cause analysis, and corrective actions.
- Partner with Process, Equipment, Quality, Planning, and Maintenance teams to resolve complex manufacturing issues and improve process robustness.
- Monitor and drive key manufacturing KPIs including OEE, yield, UPH, cycle time, ...