Key Job Accountabilities :
• Lead and manage semiconductor backend manufacturing operations across Backgrind, Laser Mark, , Laser groove, Wafer Saw, AOI, and Tape & Reel processes to achieve safety, quality, delivery, cost, and productivity targets. • Drive operational excellence through continuous improvement initiatives focused on yield enhancement, cycle time reduction, equipment utilization, and cost optimization. • Lead multiple production shifts through supervisors and engineers, ensuring effective manpower planning, workforce development, and operational discipline. • Manage customer escalations, production risks, and quality excursions, ensuring timely containment, root cause analysis, and corrective actions. • Partner with Process, Equipment, Quality, Planning, and Maintenance teams to resolve complex manufacturing issues and improve process robustness. • Monitor and drive key manufacturing KPIs including OEE, yield, UPH, cycle time, on-time delivery, scrap, and labor produ...