Broadcom Inc. is looking for an experienced package design engineer in Singapore. The engineer will be responsible for designing complex flip-chip BGA packages for high-speed SerDes and RF/microwave ASICs. This role emphasizes collaboration within a worldwide R&D team working on advanced technologies such as AI, HPC, and 5G.

The ideal candidate will have a degree in Electrical Engineering and significant experience in package design, particularly in high-speed applications. Preferred experience includes working with Cadence APD and managing multiple projects effectively.