Join a renowned technology firm in Ottawa as a Senior Flip-Chip Process Architect. This pivotal role requires advanced skills in optical packaging and microelectronic solutions.

We are seeking an industry expert with deep knowledge in flip-chip and wire bonding processes. You will lead the architecture for new technologies, requiring a Master’s degree in engineering and at least eight years of relevant experience. Your responsibilities include developing process recipes, defining assembly strategies, and mentoring team members for optimum results in groundbreaking projects.

Key Responsibilities: • Develop and define assembly strategies for optical solutions • Create critical process recipes to optimize workflows • Mentor junior engineers in technical best practices • Collaborate on innovative microelectronic technology • Lead strategic initiatives for process improvement

Requirements: • Master’s degree in a relevant engineering discipline • 8+ years of experi...