ESSENTIAL DUTIES AND RESPONSIBILITIES:

• As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
• The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
• The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

REQUIRED:

• B.S. in Mechanical Engineering plus 5 years, of relevant industry experience
• Solid knowledge through academic coursework or experience required in Mechanical design
• Proficiency in CAD software (e.g. SolidWorks, Autocad)
• Knowledge of engineering drafting stand...