Responsibilities: Fast response of any lithography process or quality related issue, troubleshoot and resolve the issues Owner of PMFEA, OCAP and WI/ SOP for documentation and update Propose and lead process CIPs for chronic issue resolving Plan and conduct new process/ package development and evaluations Perform process margin study to determine the process capability of new process/ package Lead all the evaluation lots and report the evaluation results in a timely manner Provide technical training and support to troubleshoot process issues encountered in manufacturing line Work closely with other departments to ensure successful implementation of new process/ package
Requirements: Degree in Engineering or Science At least 2-3 years of experience in the semiconductor manufacturing industry with exposure to dry process such as photolithography/ plasma, sputtering; or wet process such as electrochemical plating, wet etching etc Statistical (SPC) and analytical skills (problem solving...