Job Description Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.
Job Responsibilities Research and Development - Process Innovation: Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory.
- Material Science: Investigating and selecting appropriate bonding materials (low-temperature organic/inorganic materials, Cu/oxide, Cu/polymer) to ensure strong and stable interfaces.
- Parameter Optimization: Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy.
- Problem Solving: Addressing challenges related to process inte...