About the Job

We are looking for motivated candidates to join a vibrant and collaborative team of scientists and engineers in the Advanced Manufacturing & Semiconductor Division (AMS) at the Institute of High Performance Computing (IHPC), A*STAR. The successful candidate will contribute to research and development in physics-based modelling and scientific machine learning for semiconductor packaging reliability and multiphysics systems. This research explores new computational paradigms that integrate finite-element modelling, multiphysics simulations, and machine learning techniques to enable predictive modelling and accelerated analysis of complex physical systems relevant to advanced semiconductor packaging technologies. These include thermo-mechanical reliability of electronic packages, stress evolution in heterogeneous material systems, interfacial failure mechanisms, and process?structure?property relationships in packaging materials and architectures. You wil...