Broadcom is seeking an experienced package design engineer for complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed SerDes and RF/microwave communications A/D‑D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high‑performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You’ll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

• Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package design of critical high‑f...