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XPENG | kuala lumpur, Malaysia | Posted June 19, 2026
Position Overview
Responsibilities
- Vendor & Production Management: Act as the primary interface with external packaging and testing factories (OSATs). Manage production schedules, capacity planning, quality control, and yield improvement to ensure the successful and timely delivery of chip products.
- Quality Assurance: Formulate end-to-end quality assurance plans for the packaging and testing phases. Conduct process audits and manage quality control to guarantee the success of mass production.
- Continuous Improvement: Collect and analyze operational and project data. Identify bottlenecks, drive cross-functional issue resolution, and continuously optimize local operational workflows and supply chain efficiency.
- Government Relations & Compliance: Build and liaise robust relationships with relevant Malaysian government departments, local authorities, and industry bodies. Ensure corporate regulatory compliance, secure necessary operational permits, and facil...