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IC Packaging Engineer, Materials and Packaging Characterization

Apple | San Francisco, United States | Posted May 27, 2026

Position Overview

**Role Number:** 200660329-3401

**Summary**
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products.

**Description**
As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.

**Minimum Qualifications**

+ BS and a minimum o...

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