A global semiconductor company is seeking a Flipchip CSP Manufacturing Process Engineer in Baguio, Philippines. The ideal candidate will drive continual improvement and handle the FCCSP package's development and qualification. Responsibilities include collaborating with various teams and managing project communications. Candidates should have a Bachelor's degree in Engineering, strong analytical skills, and proficiency in Microsoft Office. Experience with FCCP packaging is a plus. Join a team that values innovation and provides competitive benefits.
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