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Equipment Associate Engineer

STATS ChipPAC | singapore, Singapore | Posted June 04, 2026

Position Overview

Key Job Accountabilities (Actual daily deliverables)
  • Responsible for maintenance and repair of Wafer Process related systems such as Endura PVD, nexx PVD and Descum machine.
  • Perform set-up and conversion to support production in thin film.
  • Develops creative and innovative solutions to problems with considerable initiative and independent thought.
  • Acts independently to determine methods and procedures and may provide guidance to less experienced team members.
  • Communicates with engineers, peer specialist or external vendors to resolve problems and to provide advanced training to less experienced technical specialists.
  • To identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing costs.
Required Experience and Qualifications (Required knowledge, skills and experience---however acquired)
  • Knowledge of practical applications of ...

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