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ENGR STAFF, PROCESS; PKG&ASSY

onsemi | Seremban, Malaysia | Posted June 02, 2026

Position Overview

**Job Summary:**

· New Package Technology and New Platform Module Development

o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).

o Good understanding of MRS and generate PRS with SCD definition.

o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.

o Familiar with DFM, to secure robust manufacturability with quality requirements.

o Good understanding of power module package design rule, design rule update with new platform development.

o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).

o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).

o Drive problem ...

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