This PDE Yield Enhancement (YE) Engineer within Package Development Engineering works on yield monitoring, excursion management, and stabilization during High Bandwidth Memory (HBM) New Product Introduction (NPI). The role ensures robust yield performance from first silicon through NPI ramp and early HVM, collaborating with Process Integration, MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Process Control Systems.

• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, while exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.
• Account for HBM NPI builds across Post Wafer Finishing (PWF), Assembly, and test, performing defect breakdown and Physical Failure Analysis (PFA) submis...