At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

Modeling Engineer

Lausanne, Switzerland

Responsibilities

• Implement, document, and maintain software for system-level modelling of serial communication links in MATLAB, Python, and C++
• Work closely with system ...