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Job Description:

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. •2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.

Job Scope (Advanced Package Technology Engineer)

–Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs...