Req. Number
26-384

Job Description

Job Summary:



Performs basic and routine electronic assembly operations on components or subassemblies. Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.



Job Responsibilities:


+ Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach

+ This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers.

+ Clean PCBs and assemblies throughout the process and after completion. Maintain log...